NVIDIA® Jetson Orin NX / Orin Nano Fanless Panel PC
• NVIDIA® Jetson Orin™ NX 16GB
(1024 CUDA cores + 8-core ARM Cortex-A78AE CPU + 16 GB LPDDR5)
• NVIDIA® Jetson Orin™ NX 8GB
(1024 CUDA cores + 6-core ARM Cortex-A78AE CPU + 8 GB LPDDR5)
• NVIDIA® Jetson Orin™ Nano 8GB
(1024 CUDA cores + 6-core ARM Cortex-A78AE CPU + 8 GB LPDDR5)
Platform Security Controller (PSC), Security Engine (SE)
10.1″
1280 x 800
1000 nits
800:1
178/178
50000
PCT w/ AG and AF treatment
Optical Bonding
1 x Line-out, 1 x Mic-in (optional)
• 1 x 2.5 GbE (Optional 4 x PoE+ for PoE model)
• 1 x GbE via M12 X-code
4 x GMSL-2 via FAKRA (for GMSL Model)
1 x CAN FD via M8
2 x USB 2.0 via M8
3 x DI (DC 60 V) + 4 x DO (12VDC/100mA)
• 1 x RS-232/422/485 via M8
• 1 x RS-232 via M8
1 x USB Type-C (device only)
CE, FCC Class A, UKCA, E-Mark
• 1 x M.2 3042/3052 Key B for WWAN w/ Nano SIM support
• 1 x M.2 2230 Key E for Wi-Fi/BT
1 x M.2 2242 Key M for NVMe SSD (Pre-installed system BSP)
DC 9-60V (nominial power input DC 12V/24V/48V)
OCP, OVP, surge protection, reversed polarity protection
Ignition detection
Removable top tray for RTC coin cell battery
NVIDIA® JetPack 6.2 or above
(Jetson Linux and NVIDIA® development tools included)
-25°C ~ 60°C (-13°F ~ 140°F) with 0.6 m/s airflow
-40°C ~ 85°C (-40°F ~ 185°F)
10% RH ~ 95% RH (non-condensing)
• IEC 60068-2-64, random, 2.5G@5~500Hz, 1hr/axis
• MIL-STD-810H, Method 514.8, Procedure I, Category 4
MIL-STD-810H, Method 516.8, Procedure I, trucks and semi-trailers=15G (11ms)
6 x SMA connector mounting hole
VESA 100 x 100
4.15 kg (9.15 lb)
260 x 179 x 75 (10.24 x 7.05 x 2.96 in.)
IP66
VPC-101RB2S-OB-(P/G2)-(ONX16/ONX8/ON8)
(P=with PoE+, G2=with GMSL, None=w/o function board)
Jetson Platfom:
ONX16= Jetson Orin 16GB
ONX8= Jetson Orin 8GB
ON8= Jetson Orin Nano 8GB
Made in Taiwan
M.2 2242 Key M NVMe SSD 240G/256G/480G/512G/960G, -40°C ~ 85°C
M.2 2230 Key A-E Wi-Fi module, -40°C ~ 85°C
M.2 3042/3052 Key B WWAN module w/ thermal kit, -40°C ~ 85°C
M.2 2242 Key B GNSS module, -40°C ~ 85°C
Taipei, Taiwan, June 16, 2026 – SINTRONES Technology Corp. (TWSE 6680), a global leader in edge AI computing solutions, announces the launch of its first rugged edge AI panel PC — the VPC-101RB2S. Equipped with a sunlight-readable touchscreen, NVIDIA® AI computing module, and GMSL-2 camera deserializer, the VPC-101RB2S is engineered for advanced computer vision and human-machine interaction in demanding environments. Designed with Sunlight Readable Display for Outdoor Harsh Environments The 10.1” VPC-101RB2S features a high-brightness 1280 x 800 touch panel with optical bonding (OB), anti-glare (AG), and anti-fingerprint (AF) coatings, ensuring visual clarity and smooth touch response even in direct sunlight. Its IK08-rated cover glass and IP66-rated enclosure provide robust protection against impact, rain, and dust, making it ideal for outdoor deployments in unpredictable weather. With wide voltage support (DC 9–60V) and an extended operating temperature range (-25°C to 60°C), this AI-enabled panel PC is built for reliability in mining, agriculture, and other rugged industries. It enhances safety and efficiency in operator-guided tasks such as exploring, hauling, planting, and spraying, while supporting AI-powered automation for autonomous heavy vehicles such as mining trucks and smart agricultural machinery. Advancing Edge AI Computing with Scalable AI Performance and Power Efficiency The VPC-101RB2S offers a choice of NVIDIA® Jetson Orin™ NX (16GB/8GB) or Orin™ Nano (8GB) modules, delivering up to 157 TOPS of AI performance or operating at power levels as low as 7W through adjustable power modes. This configurable performance-to-power balance enables adaptation to fluctuating environments and scalable workloads, from energy-sensitive lightweight tasks to compute-intensive operations. Versatile Interfaces for Diverse Vision AI Deployment To enable precise navigation, object detection, and real-time control, the VPC-101RB2S supports up to four GMSL-2 cameras, transmitting high-resolution video over...
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