Edge AI Rugged Computer
ABOX-5221(P)(G)-IP66 Series

Intel® Core™ Series 2 Processors with Discrete GPU Options, High-Bandwidth 10GbE and IP66 Edge AI Computer

• Intel® Core™ Series 2 Processors
• NVIDIA RTX™ Embedded and Intel® Arc™ GPU Options for Scalable AI Accelerating Solution
• 2 x Marvell 10GbE for High-Bandwidth Uplink and Aggregated Downlink Connection
• 4 x 2.5GbE with PoE+ Option Provides Simplified Connection to Edge Devices
• Front Removable RTC Battery Design for Easy Maintenance
• IP66 Ingress Protection

Product Status: Sample Available
Conformité Européenne FCC Certification E-Mark Certification EN 50155 Wide voltage Wide temperature Fanless
SYSTEM
Processor

• Intel® Core™ 9 Processor 273PTE
• Intel® Core™ 7 Processor 251TE
• Intel® Core™ 5 Processor 221TE

Graphics

• Processor-integrated GPU –
Intel® UHD Graphics 700 Series
• Optional discrete GPU –
NVIDIA RTX™ Embedded 2000 Ada / 3500 Ada / 5000 Ada
Intel® Arc™ A370E

Chipset

• R680E

Memory

• 2 x DDR5-5600 SO-DIMM up to 96GB (ECC support with ECC DRAM)

Security

• TPM 2.0

Watchdog

• Auto reset for unresponsive system
(custom 1-255 sec/min settings in BIOS)

INTERFACE
Video

• 2 x HDMI® up to 3840 x 2160 @ 60Hz as specified in HDMI 2.0b

Ethernet

• 2 x 10GbE (Marvell AQC113) via M12 X-code
• 4 x 2.5GbE (Intel I226IT) via M12 X-code
* ETH3 supports Intel® AMT
** PoE supports 25.5W per port with total power budget: 120W

USB
  • 2 x USB 3.2 Gen 2
DIO
  • 8 x DI (DC 5-60V), 8 x DO (DC 5V/100mA) via M12 A-code
COM
  • 2 × RS-232/422/485 via M12 A-code
INTERNAL EXPANSION

M.2

  • 1 x M.2 3042/3052 Key B for WWAN w/ dual Nano SIM support
  • 1 x M.2 2230 Key E for Wi-Fi/BT, GNSS, or CAN Bus module
    * Thermal solution is required for M.2 5G module.

Mini PCIe

  • 2 x Mini PCIe (full-size)
STORAGE
Storage Type
  • 1 x M.2 2280 Key M for NVMe/SATA SSD
  • 1 x M.2 2280 Key M for NVMe SSD
  • 2 x 2.5″ SATA SSD
POWER
Power Input
  • DC 18-60V (nominal power input DC 24V/48V) via M12 K-code
Power Protection
  • OCP, OVP, surge protection, reversed polarity protection
Power Management
  • Ignition detection, Smart Power Management
RTC Battery
  • Removable front tray for coin cell battery
Battery Backup Unit (BBU)

• Optional battery kit for up to 10 minutes emergency backup time
(Battery charging Temp. 0°C ~ 45°C and discharging Temp. -10°C ~ 60°C)
* BBU backup time varies depending on actual overall system power consumption and battery is required to be charged before being used for system power backup
** Operating temperature will be limited within -10°C and 60°C with the battery kit installed.

Patent No.: M447854 (Built-in battery)

SOFTWARE
Operating System
  • Windows 11 IoT Enterprise LTSC
  • Ubuntu 26.04 LTS
ENVIRONMENTAL
Operating Temp.

-40°C ~ 70°C (-40°F ~ 158°F) with 0.6 m/s airflow
*Operating temperature varies by accessories installed.

Storage Temp.

-40°C ~ 70°C (-40°F ~ 158°F) with 0.6 m/s airflow
*Operating temperature varies by accessories installed.

Relative Humidity
  • 10% RH ~ 90% RH (non-condensing)
Vibration
  • IEC 60068-2-64, random, 2.5G@5~500Hz, 1hr/axis
  • MIL-STD-810H, Method 514.8, Procedure I, Category 4
Shock
  • MIL-STD-810H, Method 516.8, Procedure I, trucks and semi-trailers=15G (11ms)
CERTIFICATION / COMPLIANCE
  • CE, FCC Class A, UKCA, E-Mark, EN 50155, EN 45545-2 (R25), EN 62638-1
MECHANICAL
Construction

• Aluminum Alloy

Antenna

• 7 x SMA connector mounting hole

Mounting

• Wall mounting

Net Weight
  • 6 kg (13.23 lbs)
Dimensions (L x W x H)
  • 290 x 253.5 x 101.5 mm (11.42 x 9.98 x 4 in.)
Ingress Protection
  • IP66
ORDERING INFORMATION
Model Number
  • ABOX-5221(P)(G)-IP66-zzzzz (P= w/ PoE, G=w/ Discrete GPU, zzzzz=273PTE=Intel® Core™ 9 273PTE, zzzzz=251TE=Intel® Core™ 7 251TE, zzzzz=221TE=Intel® Core™ 5 221TE)
Description
  • Intel® Core™ Series 2 Processors with Discrete GPU Options, High-bandwidth 10GbE and IP66 Edge AI Computer
State of Origin
  • Made in Taiwan
OPTIONAL ACCESSORIES
Memory
  • DDR5-5600 SO-DIMM, 8 GB to 48 GB, -40°C ~ 85°C (ECC option available)
Storage
  • M.2 2280 Key M NVMe SSD w/ thermal kit, -40°C ~ 85°C
  • M.2 2280 Key B-M SATA SSD w/ thermal kit, -40°C ~ 85°C
  • 2.5″ SATA SSD, -40°C ~ 85°C
Wi-Fi
  • M.2 2230 Key A-E Wi-Fi module, -40°C ~ 85°C
WWAN
  • M.2 3042/3052 Key B WWAN module w/ thermal kit, -40°C ~ 85°C
GNSS
  • M.2 2230 Key A-E GNSS module, -40°C ~ 85°C
  • M.2 2242 Key B GNSS module, -40°C ~ 85°C
  • Mini PCIe GNSS module, -40°C ~ 85°C
CAN Bus
  • M.2 2242 Key B CAN Bus module, -40°C ~ 85°C
  • Mini PCIe CAN Bus module, -40°C ~ 85°C
Battery (BBU)
  • BAT-5200 battery kit, charging Temp. 0°C ~ 45°C, discharging Temp. -10°C ~ 60°C
Power Adapter
  • AC/DC 100-240V/24V 280W C14 bare wire power adapter

OPTIONAL DISCRETE GPU

Discrete GPU NVIDIA RTX™ Embedded 5000 Ada Generation NVIDIA RTX™ Embedded 3500 Ada Generation NVIDIA RTX™ Embedded 2000 Ada Generation Intel® Arc™ A370E
Graphic Cores 9728 CUDA / 304 Tensor 5120 CUDA / 160 Tensor 3072 CUDA / 96 Tensor 8 Xᵉ-cores / 128 Execution Units
Memory Type/Size GDDR6 16GB GDDR6 12GB GDDR6 8GB GDDR6 4GB
AI TOPS* 682 369 232 56
System Operating Temp. 0°C ~ 60°C 0°C ~ 60°C 0°C ~ 70°C 0°C ~ 70°C
Processing