• NXP i.MX 8QuadXPlus Automotive SoC (AEC-Q100 Grade 3)
• Integrated 4 x Arm Cortex-A35 Cores Up to 1.2 GHz
• 1 x Arm Cortex-M4F Core Up to 264 MHz
• Processor-integrated GPU-1 x GC7000Lite with 4 x Vec4 shader cores
• 1x On-board LPDDR4 4 GB
• Built-in Accelerometer, Gyroscope, and Magnetic Sensor
• System power on/off 128 sec
• 10.1″
• 1280 x 800
• 1000 nits
• 800:1
• 178/178
• 50000
• PCT w/ AG and AF treatment
• Air Bonding(Option Optical Bonding)
• IK08
• 1 x Line-out, 1 x Mic-in
• 2 x GbE
• 3 x CAN-FD (optional)
• 2 x USB 3.2 Gen 2
• 8 x DI (DC 5-60V), 4 x DO (DC 5V/100mA) (optional)
• 1 x RS-232/422/485
• 1 x RS-232
• 1 x USB Type-C for FW update
M.2
• 1 x M.2 3042/3052 Key B for WWAN w/ Nano SIM Suppot
• 1 x M.2 2242 Key B for GPS
• 1 x M.2 2230 Key E for Wi-Fi
• Onboard eMMC 5.1 32 GB
• 1 x Micro SD Slot
• DC 9-60V (nominial power input DC 12V/24V/48V)
• OCP, OVP, surge protection, reversed polarity protection
• Ignition detection, Smart Power Management
• Yocto Linux
• -30°C ~ 70°C (-22°F ~ 158°F), ambient w/ air ow 0.6m/s airflow
• -40°C ~ 80°C (-40°F ~ 176°F)
• 10% RH ~ 95% RH (non-condensing)
• IEC 60068-2-64, random, 2.5G@5~500Hz, 1hr/axis
• MIL-STD-810H, Method 514.8, Procedure I, Category 4
• MIL-STD-810H, Method 516.8, Procedure I, trucks and semi-trailers=15G (11ms)
• CE, FCC Class A, UKCA
• 6 x SMA connector mounting hole
• VESA/Panel mounting
• 251.5 x 169.5 mm (9.90 x 6.67 in.)
• 2.08 kg (4.59 lb)
• 262 x 180 x 52mm (10.31 x 7.09 x 2.05 in.)
• Front Frame IP66
• VPC-101RA1S-(OB)
OB=Optical Bonding
• 10.1″, 1280×800, 1000nits, PCT, NXP i.MX 8QuadXPlus Automotive-Grade SoC / Onboard LPDDR4 4GB / Onboard eMMC 5.1 32GB / 2 x GbE / 2 x RS-232 / 2 x USB 3.2
• Made in Taiwan
• M.2 2230 Key A-E Wi-Fi module, -40°C ~ 85°C
• M.2 3042/3052 Key B WWAN module w/ thermal kit, -40°C ~ 85°C
• M.2 2242 Key B GNSS module, -40°C ~ 85°C
• AC/DC 100-240V/12V 60W C14 power adapter